Palavra-chave: PRODUCT DEVELOPMENT

ADDITIVE MANUFACTURING KNOWLEDGE MANAGEMENT DIFFICULTIES 3D PRINTING PACKAGING POLI LACTIC ACID INFRAESTRUCTURE POYAMIDE HANDLING PACKAGING VIRTUAL SIMULATION IOT DESIGN MANAGEMENT USABILITY MAN-OBJECT DFA/DFM CONCURRENT ENGINEERING ENVIRONMENT ELECTROSPINNING MARKETING IMPLICATIONS BENEFITS INDUSTRY 4.0 INTEROPERABILITY BIG DATA TEMPOROMANDIBULAR