Palavra-chave: PRODUCT DEVELOPMENT

VIRTUAL SIMULATION CONCURRENT ENGINEERING ENVIRONMENT TEMPOROMANDIBULAR HANDLING PACKAGING DIFFICULTIES BENEFITS POLI LACTIC ACID 3D PRINTING USABILITY INFRAESTRUCTURE INTEROPERABILITY IOT BIG DATA ELECTROSPINNING ADDITIVE MANUFACTURING DESIGN MANAGEMENT POYAMIDE DFA/DFM KNOWLEDGE MANAGEMENT MARKETING IMPLICATIONS PACKAGING MAN-OBJECT INDUSTRY 4.0