Palavra-chave: PRODUCT DEVELOPMENT

KNOWLEDGE MANAGEMENT 3D PRINTING ADDITIVE MANUFACTURING DESIGN MANAGEMENT POLI LACTIC ACID INTEROPERABILITY ELECTROSPINNING MAN-OBJECT POYAMIDE DIFFICULTIES IOT HANDLING PACKAGING INDUSTRY 4.0 VIRTUAL SIMULATION PACKAGING CONCURRENT ENGINEERING ENVIRONMENT BENEFITS MARKETING IMPLICATIONS BIG DATA INFRAESTRUCTURE USABILITY TEMPOROMANDIBULAR DFA/DFM